# ITW Dynatec - Adhesive Coating and Laminating

## Source
URL: https://www.itwdynatec.com/solutions-by-industry/adhesive-coating-and-laminating
Fetched: 2026-06-27

## Raw Content

**Industry Positioning:**
ITW Dynatec positions hot melt as superior to conventional methods (roll coating, scatter coating, needle-punching, flame laminating, ultrasonic) which are described as "inefficient, costly, and some even require extreme preventative measures to avoid environmental damage."

**Key Technologies:**
- **Slot Die Technology** (APEX slot die) — exceptional results for solid barrier/coating on nonwoven substrates
- **UFD (Unified Fiber Deposition) Fiberized Spray** — creates flow characteristics between composites; most precise applicator for size and placement of multiple fiber size patterns
- Laminated Plate Technology (LPT) — produces monofilament strands of adhesive, uses heated air to elongate strands

**Sub-Industries Covered:**
- Technical Textiles
- Nonwovens Applications
- Tape & Label

**Slot Applicator Technology Features:**
- Custom designs with multiple hose feed for precision patterns
- Extreme high-speed module technology
- Eagle Beak die lip technology for quality intermittent applications
- Non-contact operation — won't compress or crush substrate
- Ideal for heat-sensitive substrates

**Adhesive Supply Units (for this segment):**
- Up to 1,600 lb hopper capacity
- Pump output up to 1,400 lbs/hr
- Patented Melt-On-Demand no char system
- Multiple grid rows for superior melt rate

**Performance Advantages:**
- Vary coat weights and web widths on the fly
- Faster production speeds
- Intermittent patterning capabilities
- Reduced costs
- Increased line speeds up to and above 2,500 ft/min
- Eliminate burn-through of thin substrates
- Protect substrates with non-contact technology
- Provide measured breathability for filter production
- Monitor and compensate for line speed variances
- Single and multiple layer laminating capability

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## Factronics Brain Notes

**Relevance to Factronics Customers (packaging, food, beverage, manufacturing):**

1. **Hot Melt vs. Conventional Messaging** — The page provides ready-made sales narrative: conventional methods are "inefficient, costly, and environmentally damaging." Factronics can use this to pitch ITW Dynatec hot melt as a modern replacement.

2. **Line Speed as ROI Metric**: "2,500 ft/min" line speeds are a concrete data point for quoting productivity gains to packaging manufacturers.

3. **Non-Contact Technology** — Critical for food/beverage packaging where substrate integrity matters (no compression, no burn-through).

4. **Melt-On-Demand No Char System** — Directly supports Factronics' adhesive waste reduction value prop. Charred adhesive = waste. No char = less waste.

5. **Slot Die & UFD Technology** — While more relevant to nonwovens/coating, the precision messaging ("vary coat weights on the fly") translates to packaging precision sealing.

6. **Technical Textile/Nonwovens** — Less relevant to Factronics' core packaging/food/beverage/manufacturing focus, but useful if customers have diversified operations.